Semiconductor Packaging News4h
China’s AI balancing act — beating the U.S. but keeping the tech from threatening Beijing’s rule
China’s AI balancing act — beating the U.S. but keeping the tech from threatening Beijing’s rule: Summary Max Tegmark warns that China's race to create smarter-than-human AI ...
Semiconductor Packaging News4h
New US chip sanctions to hit Chinese tool makers, but Japan, Netherlands exempt
The U.S. will impose sweeping semiconductor export restrictions targeting 140 Chinese firms, including Naura Technology, Piotech, and Huawei-linked companies. The move aims to stymie China's ...
Semiconductor Packaging News4h
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027: Summary TSMC revealed at the OIP Ecosystem Forum in Europe that its CoWoS packaging technology will achieve c ...
Semiconductor Packaging News4h
US adds curbs on chip tools to China
Summary The Biden administration tightened restrictions on China, targeting AI chip components and chipmaking equipment with new export controls. The US blacklisted 140 Chinese entities, citing ...
Semiconductor Packaging News4h
Samsung Electronics' half-century chip biz faces unprecedented challenges in AI era
Samsung Electronics' half-century chip biz faces unprecedented challenges in AI era: Summary Samsung Electronics faces intense pressure as the global memory market pivots to AI-fo ...
Semiconductor Packaging News4h
Intel CEO Gelsinger retires amid chipmaker’s turnaround plan
Summary Intel CEO Pat Gelsinger has retired amid the company’s turnaround efforts, leaving Intel CFO David Zinsner and Products CEO Michelle Holthaus as interim co-CEOs. Gelsinger’s exit follows ...
Semiconductor Packaging News4h
Chip Companies Play Bigger Role In Shaping University Curricula
Chip Companies Play Bigger Role In Shaping University Curricula: Summary The engineering talent shortage has pushed companies to hire and train fresh graduates, leveraging tailore ...
Semiconductor Packaging News4h
The Art of Failure Analysis 2024
Summary Engineers at the IPFA conference celebrate creativity in failure analysis with the Art of Failure Analysis contest. Submissions feature surprising microscopy images, like melted silicon ...
Semiconductor Packaging News21h
Intel CEO Pat Gelsinger is Out, Stock Up 5%
Intel CEO Pat Gelsinger retired effective Dec. 1, ending a turbulent tenure marked by ambitious initiatives and massive spending to revive the company. Interim co-CEOs and board member Frank Yeary now ...
Semiconductor Packaging News21h
The Forgotten Story of How IBM Invented the Automated Fab
Summary In 1970, Bill Harding led IBM's Project SWIFT to revolutionize semiconductor manufacturing. Automating processes ...
Semiconductor Packaging News6d
STM32WL33 low-power, long-range microcontrollers with dedicated ecosystem extensions now available
The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized for automotive ... ST has introduced ...
Semiconductor Packaging News7d
HPC customer engages Sondrel for multi-million dollar, high end chip design
Sondrel has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer. Ollie Jones ... Semiconductor ...