India], March 26: izmo Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive ...

Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing ...

Key applications include: High-speed data centers and telecommunications, where photonic chips ... packaging, integrating active auto-alignment, advanced optical imaging, and detector systems with ...

Unprecedented growth and demand for edge computing and high-performance computing (HPC) is creating new opportunities and significant challenges for custom chips. We spoke to Sondrel CEO Oliver Jones ...

Pragmatic Semiconductor, a developer of flexible semiconductor technology, launcheds its latest RFID NFC product line.

Pragmatic NFC Connect product innovation expands market opportunities for edge and item-level intelligence at scale ...

Understanding chip design as a strategic necessity, the Ministry of Electronics and Information Technology (MeitY), with its ...

HBM-based chip designs are being categorized as AI-related and subject to tighter controls. Over the last few months, there has been a sustained decline in CoWoS advanced packaging orders from ...

There was speculation last year about the M3 Max chip lacking UltraFusion technology, but Apple's announcement today has proven that rumor was false. Apple's custom-built UltraFusion packaging ...

University of Glasgow researchers developed a system that aims at wireless sensing, without the environmental impact of ...

today announced its participation in two significant projects funded by the U.S. Department of Commerce CHIPS National Advanced Packaging Manufacturing Program (NAPMP). Each project was awarded $ ...