India], March 26: izmo Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive ...
Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing ...
Key applications include: High-speed data centers and telecommunications, where photonic chips ... packaging, integrating active auto-alignment, advanced optical imaging, and detector systems with ...
Pragmatic Semiconductor, a developer of flexible semiconductor technology, launcheds its latest RFID NFC product line.
Pragmatic Semiconductor Ltd., a pioneer in flexible semiconductor technology, today announced the launch of its latest radio ...
The A18 chip inside the Apple iPhone 16e is not as powerful as the one in the more expensive iPhone 16, and it shows.
University of Glasgow researchers developed a system that aims at wireless sensing, without the environmental impact of ...
The more interesting thing is that the company just delivered another blowout quarter, with revenue exploding and AI-related ...
Akamai will show its range of cloud-based media delivery, computing, and security capabilities at the 2025 NAB Show in Las ...
Senior technical and executive management of select technology companies will have the opportunity to observe the highly ...
While an increase in domestic manufacturing can help tech companies, there are challenges to consider as well.
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