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Electronic Design
1d
Co-packaged Optics Delivers High-Performance Chip Communication
IBM’s co-packaged optics offers 6X the beachfront density thanks to the use of smaller fibers with an 18-µm pitch.
3d
IBM’s Co-Packaged Optics Prototype Packs More Bandwidth Into a Single Connector
IBM’s working prototype significantly increases the number of optical fibers connecting at the edge of a silicon photonics ...
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