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Planned to be commissioned by the end of this decade, the third fab will produce chips using 2nm or more advanced processes.

Taiwan Semiconductor Manufacturing marks another milestone as it breaks ground on third Phoenix factory with Commerce Secretary Lutnick attending.

The Taiwan Semiconductor Manufacturing Company has started construction on a third semiconductor fabrication facility in ...

The Taiwan Semiconductor Manufacturing Company (TSMC) broke ground Tuesday on its third factory in Arizona, widening the ...

Investing.com-- Taiwan Semiconductor Manufacturing (NYSE: TSM) (TSMC) said on Tuesday it had broken ground on a third chip ...

Apple has reaffirmed its commitment to making chips in the United States as Taiwan Semiconductor Manufacturing Company (TSMC) ...

TSMC Arizona broke ground on its third factory in Arizona on Tuesday while getting a visit from a top Trump administration ...

Taiwan Semiconductor Manufacturing Co. (NYSE:TSM), the worlds largest contract chipmaker, has officially broken ground on its third semiconductor fabrication plant in Phoenix, Arizona. This marks a ...

The Taiwan Semiconductor Manufacturing Company (TSMC) took another major step in expanding its north Phoenix campus on Tuesday. The company broke ground on its third semiconductor manufacturing fab, ...

TSMC breaks ground for its third Fab 21 module in the U.S., which will produce chips on A16 and N2 process technologies ...

Taiwan Semiconductor Manufacturing (NYSE:TSM) shares rise nearly 2% on early trading Wednesday on the news that the company has broken ground on its third semiconductor facility in Phoenix, Arizona, e ...