Shares of key chip suppliers jump as U.S. reportedly considers toned-down China curbs: Summary Global semiconductor stocks surged Thursday as reports indicated the U.S. may impose ...

ASML and peers climb on hopes for less severe US curbs on China chips: Summary Shares of ASML surged 4.3% on Thursday, with European chip equipment peers also climbing after Bloom ...

Exploring the Potential for Edge Compute: Summary The IIC Exhibition and Global CEO Summit in Shenzhen spotlighted edge computing and intelligence ...

Summary Taiwan's PSMC is constructing a 12-inch wafer fab for Tata Electronics in India, while Lam Research seizes the opportunity by planning an office at the site, reflecting India's growing ...

Summary Rebellions Inc. and Sapeon Korea Inc. have merged to form Rebellions, valued at $929.8 million. Led by CEO Park Sun ...

Summary TSMC faces challenges in Arizona and Kaohsiung, tackling safety violations, alleged hiring discrimination, and unexploded WWII ordnance r ...

Summary The Biden administration is preparing new restrictions on semiconductor equipment and AI memory chip sales to China, targeting some Huaw ...

Summary The chiplet revolution democratizes silicon system design, enabling smaller teams to create advanced multi-die solutions. With external partners, expertise, and collaborative supply chains, ...

Summary Automakers are embracing quantum computing to overcome EV adoption barriers like battery efficiency, charging speed, and drivetrain optimization. By simulating molecular interactions and ...

The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized for automotive ... ST has introduced ...

Sondrel has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer. Ollie Jones ... Semiconductor ...

The global wafer foundry market will grow 11.5% annually, reaching $270 billion by 2029, driven by AI and HPC demand. Foundries are advancing to 1.4nm processes and 2.5D/3D packaging while addressing ...