electronics360.globalspec23h
Solving key challenges in 224G interface packaging
G networking links and interfaces are in the commercialization stage, and 224G implementations for the data center are not ...
Semiconductor Engineering6d
Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many-Core RISC-V SoC
Material properties of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack in ...
Digi Times4d
CCP Contact Probes targets AI chip supply chain with advanced packaging solutions
Benefiting from the booming demand for testing related to artificial intelligence (AI), CCP Contact Probes, a probe ...
Electronic Products4d
MPUs offer multiple packages for HMI
Microchip’s SAMA7D65 MPUs with advanced graphics and connectivity provide greater flexibility with SiP and SoC packages for ...
Electronic Design5d
Automotive ICs Go “Back to the Future” with Minimalist Logic Devices
The basic digital-logic functionality of small-scale integration still has a role, as evidenced by a new shift register and ...
Electronics Weekly6d
Analogue / Linear / Mixed Signal ICs
iC-Haus has created a high-speed sine-to-digital signal conditioning interpolation IC for magnetic or optical position sensors. “Linear scales and angular sensors can benefit from higher resolution ...