Incorporating silver nanoparticles (AgNPs) into plastic packaging has been proposed as a novel way to protect against foodborne disease and extend the shelf life of food. Despite their demonstrated ...

Over the past year, Saras has secured seven foundational patents for its capacitor and STILE technologies from the United States Patent Trademark Office. This achievement underscores the company’s ...

Under this collaboration, RRP Electronics will integrate Deca’s Wafer-Level Chip Scale Packaging and M-Series Fan-Out Wafer-Level Packaging technologies into its processes. This will elevate the ...